MULTILAYER PROCESS EQUIPMENTS
  1. INNERLAYERS
  2. REGISTRATION OF INNERLAYERS
    a) PIN LAMINATIONPOST ETCH PUNCH
    a)PPIN LAMINATIONa)P(UNDER DEVELOPMENT)
    a )PIN LAMINATIONPOST ETCH DRILL
    a)PPIN LAMINATIONa)PMID-707
    b) MASS LAMINATION
    POST ETCH DRILL FOR WELDING (BONDING) MACHINE
    MODEL SPINDLE THE NO. OF HOLESIN ONE OPERATION DRILL POSITION OPTIMIZING MATHOD
    MPD506
    		 1SPINDLE 1 TARGET CENTER
    MMD1000
    		 2 SPINDLE 1 to 3 TARGET CENTER
    2-POINT COMPENSATION
    MID707
    		 2 SPINDLE 1 to 160 TARGET CENTER
    MULTI-POINT COMPENSATION

    WELDING (BONDING) MACHINES
    MODEL ALIGNMENT BASE ALIGNING METHOD
    MRP330
    		 GUIDE HOLES GUIDE PIN
    MRA3000
    		 ETCHED TARGETS CCD CAMERA / X-Y-Y TABLE
    MRX3030
    		 ETCHED TARGETS X-RAY CAMERA / X-Y-Y TABLE
  3. PRE-PREGiMRP330j& COPPER FOIL ATTATCH
  4. LAMINATION
  5. GUIDE HOLE DRILL ON MULTILAYER
    ..................................FOR CNC MECHANICAL DRILL
    ..................................FOR LASER DRILL
    ..................................FOR EXPOSURE MACHINE
    ..................................FOR ROUTER / BEVELER
    MODEL SPINDLE THE NO. OF HOLESIN ONE OPERATION DRILL POSITION OPTIMIZING MATHOD
    MPX808
    		 1 SPINDLE 1 TARGET CENTER
    MMX880
    		 2 SPINDLE 1 to 3 TARGET CNETER2-POINT COMPENSATION
    MMX888
    		 2 SPINDLE 1 to 160 TARGET CENTERMULTI-POINT COMPENSATION
  6. POST-LAMINATION LAYER SLIP ANALYSIS
    LAYER SLIP MEASURMENT SOFTWARE
  7. SHEARING & BEVELLING
  8. CNC MECHANICAL DRILL

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