SINGLE SPINDLE DRILLING MACHINE WITH CCD CAMERA: MPD-506
Independent of operator's skill, the machine detects the target center
and drill with the accuracy of 20 ƒÊm (0.0008''). The target does not have
to be a round mark.
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TWO SPINDLE DRILLING MACHINE WITH CCD CAMERA: MMD-1000
1) 2-POINT COMPENSATION
Measuring the distance between 2 targets, the machine splits the difference
from its theoretical distance with center base, and determines the drilling
positions. Drilling at the target center is also available.
2) PRODUCTION CONTROL
A highly accurate and patented Jig Plate Measuring System monitors targets
to enforce tolerance restriction.
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TWO SPINDLE DRILLING MACHINE WITH CCD CAMERA: MID-707
1) MULTI-POINT COMPESNATION
Measuring the each distance between targets, the machine determines the
drilling position where the differences from its theoretical positions
are minimized, correcting not only X, Y, but also Į. Drilling at the target
center is also available.
2) PRODUCTION CONTROL
A highly accurate and patented Jig Plate Measuring System monitors targets
to enforce tolerance restriction.
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AUTO-POSITIONING SINGLE SPINDLE DRILLING MACHINE WITH CCD CAMERA:APD-800S
/ 1000S
Process data is pre-programmable with attached keyboard and saved in HD.
Operator only has to load the program file to start the operation.
The work is positioned as programmed so that camera can find the target.
Interactive Instruction method allows easy operation..
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SINGLE SPINDLE DRILLING MACHINE WITH X-RAY: MPX-808
Equipped with X-ray unit, the machine detects the target center coated
by copper foil, and drill with the accuracy of 20 ƒÊm (0.0008''). The target
does not have to be a round mark.
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TWO SPINDLE DRILLING MACHINE WITH X-RAY: MMX-880
1) 2-POINT COMPENSATION
Measuring the distance between 2 targets, the machine splits the difference
from its theoretical distance with center base, and determines the drilling
positions.
2) PRODUCTION CONTROL
A highly accurate and patented Jig Plate Measuring System monitors targets
to enforce tolerance restriction.
3) AUTOMATION
The machine can be connected to Beveling machine, Thickness tester and
etc. to form automatic full line. Auto-loading device (TH80+PX80S )
is available.
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TWO SPINDLE DRILLING MACHINE WITH X-RAY: MMX-888
1) MULTI-POINT COMPESNATION
Measuring the each distance between targets, the machine determines the
drilling position where the differences from its theoretical positions
are minimized, correcting not only X, Y, but also Į. Drilling at the target
center is also available.
2) ONE OPERATION
CNC mechanical guide, Laser drill guide and Exposure machine guide can
be drilled in one operation
3) LAYER ANALYSIS FUNCTION
Layer to layer slip measurement function as an option
4) AUTOMATION
The machine can be connected to Beveling machine, Thickness tester and
etc. to form automatic full line. Auto-loading device (TH80+PX80)
is available.
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FOR FULL AUTOMATION: TH80 + PX80S / PX88
1) TH80: AUTOMATIC LOADER for MMX880 / MMX888
Stacked boards are picked one by one to place to the pre-alignment device,
PX80S / PX88.
2) PX80S / PX88: PRE-ALIGNMENT DEVICE for MMX880 / MMX888
Using the wider viewing area than the drilling machines, these devises
align the loaded panel to place it within the viewing area of MMX880 /MMX888
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MANUAL ALIGNING WITH REFERENCE HOLE: MRP-330
1) MINIMUM COST
Without using rivets, the machine assist to minimize the operation cost.
2) HIGH PRODUCTIVITY
Two-Pallet Design results in high productivity
3) WELDING PrePregs on Top & Bottom (P.A.T. Pending)
The exclusive method allows welding PrePregs on top & bottom of the
book
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AUTOMATIC ALIGNING WITH ETCHED MARK:MRA-3000 (CCD
CAMERA TYPE)
1) X-Y-Y TABLE METHOD (P.A.T. Pending)
Looking at etched marks on cores, X-Y-Y Table aligns the cores compensating
the shrinkage / expansion of each core.
2) DRILLING / PUNCHING PROCESS IS UNNECSSARY
Making an alignment based on etched mark does not require any holes, which
makes it unnecessary to drill reference holes
3) FULL AUTOMATION
Full Automatic Line from laoder to unloader is also available.
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AUTOMATIC ALIGNING WITH ETCHED MARK: MRX-3030 (X-RAY
CAMERA TYPE)
1) COPPER
COATED INNERLAYER
Using X-ray enables to process copper coated innerlayers
2) X-Y-Y TABLE METHOD (P.A.T. Pending)
Looking at etched marks on cores, X-Y-Y Table aligns the cores compensating
the shrinkage / expansion of each core.
3) DRILLING / PUNCHING PROCESS IS UNNECSSARY
Making an alignment based on etched mark does not require any holes, which
makes it unnecessary to drill reference holes
4) FULL AUTOMATION
Full Automatic Line from laoder to unloader is also available.
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GUIDE HOLE PUNCH FOR FLEXIBLE / METAL BOARD: MPP-606
This machine has been designed to punch various materials, such as metal,
flexible boards, and exposure film. The optional Matrix-robot feeds the
work to the punching position as programmed and punch the target center.
One-unit-structure of Punch & Die maintains high accuracy
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GUIDE HOLE PUNCH FOR FLEXIBLE BOARD: MPP-607
This machine has been designed specifically to process flexible board at
high speed Process data is pre-programmable. Operator only has to load
the program file to start the operation. The work is positioned as programmed
so that camera can find the target. One-unit-structure of Punch & Die
maintains high accuracy
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GUIDE HOLE PUNCH FOR METAL BOARD: MPP-608
This machine has been designed specifically to process metal board with
high precision. Process data is pre-programmable. The punch can be either
at the target center or at the programmed position.
One-unit-structure of Punch & Die maintains high accuracy. Full automatic
line (APP-800)
is also available.
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FULL AUTOMATIC GUIDE HOLE PUNCH FOR METAL BOARD: APP-800
Additional loader & unloader make MPP-608 full automatic.
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GUIDE HOLE PUNCH FOR EXPOSURE FILM: MPP-101
This is the machine to punch guide holes on exposure films. Independent
of operator's skill, the machine detects the target center and punch with
the accuracy of 20 ƒÊm (0.0008''). The target does not have to be a round
mark.
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| PCB FINAL INSPECTION MACHINE: MIC-8011,MIC-8021,MIC-8031 |
The newly developed image Processing Technology gives
highly reliable detection of OPEN, SHORT, CONTAMINATION,
STAIN, SCRATCH, and DISCOLORATION on PCBs. Miss-Detection
by Over Care is minimized. The most suitable for inspection
on High Density Board such as COB and BGA,and inspection
on solder leveler PCBs. |
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