Multi-Point Compensating Punching Machine for Inner Layer Boards MIP-708
For printed circuit boards
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Example of four points compensating
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Production Control
| Product name | Multi-Point Compensating Punching Machine for Inner Layer Boards (Punching Type) |
|---|---|
| Product number | MIP-708 |
Functions and features
Capable of measuring two or more guide mark coordinate positions (multi-point compensation) on each inner layer board to calculate the compensating coordinate positions where the errors of the guide marks are the smallest relative to the design-specified punching coordinate position.
Then, each punching unit moves in the X- and Y-directions to the compensating position to perform punching. This machine accommodates 2 to 6 punching units to the specifications, thereby enabling high-speed, simultaneous punching with all the spindles. Boards are automatically ejected to the rear of the machine after punching.
- Capable of punching thin PCBs.
- Capable of punching accurately-shaped holes through 0.1 mm-thick or thinner FPCs or similarly thin inner layer boards difficult to drill.
- Quick response to board hole position variations
- The punching units can move individually in the X- and Y-directions, thereby ensuring quick response to variations of the positions of large and small holes in boards.